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 FXL3SD206 -- Level Shifting Voltage Translator
March 2009
FXL3SD206 Level Shifting Voltage Translator
Two-Port SDIO MUX/DEMUX with Three Configurable Power Supplies for SDIO Device Port Expansion
Features
Bi-Directional Interface between Two Levels: 1.65 to 3.6V Fully Configurable: Inputs and Outputs Track VDD Flexible and Programmable VDD of B and C Ports Non-Preferential Power-up; either VDD Can Power Up First Output Remains in 3-State until Active VDD Level is Reached Output Switches to 3-state if either VDD is at GND Power-off Protection Bus-Hold on Data Input Eliminates the Need for SDIO Pull-up Resistors 2:1 MUX/DEMUX of SDIO Devices in 24-Terminal Micro-MLP Package (2.5mm x 3.4mm) Direction Control is Automatic Power Switching Time (VDD_HI to VDD_LO or Reverse) is Less than 1.7s 60Mbps Throughput ESD Protection Exceeds: 12KV HBM (A, B, and C port I/O to GND) (per JESD22-A114) 1KV CDM (per ESD STM5.3)
Description
FXL3SD206 is a voltage translator with multiplexing and de-multiplexing functions for SDIO devices. It is designed for voltage translation over a wide range of input and output levels, from 1.65V to 3.6V. The multiplexing/de-multiplexing function of this device allows expansion of a host SDIO interface to two SDIO peripheral devices. When selected, each SDIO peripheral can communicate with the host through the same host interface. An alternative application allows two host devices to interface with a single SDIO peripheral. Port A is intended to connect to a host device and the voltage level tracks the VDDA. Ports B and C are intended to connect to peripheral devices. Peripheral I/O voltage levels track either VDD_HI or VDD_LO as determined by the VDD_SEL pin. During normal operation, VDD_HI must be greater than or equal to VDD_LO. The CH_SEL, VDD_SEL, and OE pins are referenced to VDD_CON. Channel communication from either Port A to Port B or Port A to Port C is controlled by the CH_SEL pin. The selected channel remains in 3-state until the VDD of each side reaches an active level and the OE pin reaches a valid high. Internal power-down circuitry places the selected channel of the device in 3-state if either side VDD removed. The direction of data is controlled automatically by the device. No direction control pin is required. The device senses input signals on any port automatically and transfers the data to the corresponding output.
Applications
SDIO Devices Cell Phone, PDA, Digital Camera, Portable GPS
Ordering Information
Part Number
FXL3SD206UMX
Operating Temperature Range
-40 to +85C
Eco Status
Green
Package
24-Pin, Micro-MLP, Quad, .6mm Thick, 2.5mm x 3.4mm Body
Packing Method
Tape & Reel
For Fairchild's definition of "green" Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
(c) 2009 Fairchild Semiconductor Corporation FXL3SD206 * Rev. 1.0.0
www.fairchildsemi.com
FXL3SD206 -- Level Shifting Voltage Translator
Application Diagrams
Power Management IC VDDA VDD_CON VDD_HI VDD Select Card Select HOST
VDD_SEL CH_SEL
In MUX Out In
VDD_LO VDD_HI SD Card 1CLK
CMD_B
CMD B 1D0~D3 VDD_LO SDIO Device WiFi LAN / Bluetooth / Memory Module
CMD Output Enable
CMD_ A
OE
Out DEMUX In Out
2CLK
CMD_C
CMD C 2D0~D3
CLK D0~D3
CLK_A D0_A~D3_A
CLK_BC D0_BC~D3_BC
Figure 1. Single Host to Two SDIO Application Diagram
Power Management IC VDDA VDD_CON
VDD SEL OE CH SEL
VDD_LO VDD_HI
VDD Select
Output Enable Card Select
SD Memory Or SDIO Device CMD
CMD A
1CLK
In MUX Out In
VDD_HI
CMD B
CMD B 1D0~D3
Application Processor
Out In DEMUX Out
2CLK
CMD C
VDD_LO Baseband Processor
CMD C 2D0~D3
CLK D0~D3
CLK_A D0_A~D3_A
CLK_BC D0_BC~D3_BC
Figure 2. Dual Host to Single SDIO Application
(c) 2009 Fairchild Semiconductor Corporation FXL3SD206 * Rev. 1.0.0 www.fairchildsemi.com 2
FXL3SD206 -- Level Shifting Voltage Translator
Pin Configuration
18 19 13 12
24 1 6
7
Figure 3. Pin Configuration (Top Through View)
Pin Definitions
Pin #
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Name
D0_A D1_A D2_A D3_A CLK_A ---CMD_A ---GND CMD_C ---CMD_B CLK_BC D3_BC D2_BC D1_BC D0_BC VDD_LO VDD_HI VDD_CON VDDA VDD_SEL CH_SEL OE
Type
Data Data Data Data Data NC Data NC Power Data NC Data Data Data Data Data Data Power Power Power Power Control Control Control
Description
Data Pin of A Port Data Pin of A Port Data Pin of A Port Data Pin of A Port Clock Pin of A Port No Connect Command Pin of A Port No Connect Ground Command Pin of C Port No Connect Command Pin of B Port Clock Pin of B or C Port Data Pin of B or C Port Data Pin of B or C Port Data Pin of B or C Port Data Pin of B or C Port B or C Port, Low Power Supply B or C Port, High Power Supply Control Pin Power Supply A-Port Power Supply Power Supply Select Pin of B and C Ports Channel Select Pin Output Enable Pin
(c) 2009 Fairchild Semiconductor Corporation FXL3SD206 * Rev. 1.0.0
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FXL3SD206 -- Level Shifting Voltage Translator
Function Diagram
Figure 4. Function Diagram
Function Table
OE
LOW HIGH HIGH HIGH HIGH
CH_SEL
Don't Care HIGH HIGH LOW LOW
VDD_SEL
Don't Care HIGH LOW HIGH LOW 3-State
Output
Normal operation; Port A to Port B channel selected; Port B tracks VDD_HI level Normal operation; Port A to Port B channel selected; Port B tracks VDD_LO level Normal operation; Port A to Port C channel selected; Port C tracks VDD_HI level Normal operation; Port A to Port C channel selected; Port C tracks VDD_LO level
Note: 1. VDD_CON: This is a power supply pin that is used by the three control pins (VDD_SEL, CH_SEL, and OE). In single host mode, VDD_CON should be tied to the same supply as the VDDA pin. In dual host mode, VDD_CON should be tied to the same supply as either the VDD_HI or the VDD_LO pin, depending upon which host is used to drive the control pins.
(c) 2009 Fairchild Semiconductor Corporation FXL3SD206 * Rev. 1.0.0
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FXL3SD206 -- Level Shifting Voltage Translator
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.
Symbol
VDD VI
Parameter
Supply Voltage DC Input Voltage
Conditions
VDDA, VDD_HI, VDD_LO, VDD_CON Data Ports A, B, and C Control Inputs (OE, CH_SEL, VDD_SEL) Output 3-State Output Active (Port A) Output Active (Port B or C) Output Active (Port B or C) VI<0V VO<0V VO>VCC
Min.
-0.5 -0.5 -0.5 -0.5 -0.5 -0.5 -0.5
Max.
4.6 4.6 4.6 4.6 VDDA+0.5 VDD_HI+0.5 VDD_LO+0.5 -50 -50 +50
Unit
V V V
VO
Output Voltage
(2)
V
IIK IOK IOH/IOL IDD TSTG
DC Input Diode Current DC Output Diode Current DC Output Source/Sink Current
mA mA mA mA C
-50 -65
+50 100 +150
DC VDD or Ground Current per Supply Pin Storage Temperature Range
Note: 2. IO absolute maximum rating must be observed.
Recommended Operating Conditions
(3)
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
VDD
Parameter
Power Supply Operating
Conditions
VDDA, VDD_HI, VDD_LO, VDD_CON VDD_HI VDD_LO Port A Port B and C Port B and C
(5) (5) (4)
Min.
1.65 0 0 0 -40
Max.
3.60 VDDA VDD_HI VDD_LO +85 10 10 10
Unit
V
VIN TA
Input Voltage Free Air Operation Temperature
V C
Data Port A at VDDA=1.65 to 3.6V dt/dV Minimum Input Edge Rate Data Ports B and C at VDD_n=1.65 to 3.6V OE, CH_SEL, VDD_SEL at VDD_CON=1.65V to 3.6V
ns/V
Notes: 3. All unused inputs and input/outputs must be held at VDDn or GND. 4. During normal operation, VDD_HI must be greater than or equal to VDD_LO. 5. The input and output voltages of Ports B and C are determined by which VDD is selected.
(c) 2009 Fairchild Semiconductor Corporation FXL3SD206 * Rev. 1.0.0
www.fairchildsemi.com 5
FXL3SD206 -- Level Shifting Voltage Translator
Application Information
Power-Up / Power-Down Sequencing
FXL translators offer an advantage in that any VDD may be powered up first. This benefit derives from the chip design. When VDDA or both VDD_HI and VDD_LO pins are at 0 volts, outputs are in a high-impedance state (see Power Up Operation table below). As a multiplexer, the device allows the unselected port to remain in a high-impedance state for power saving. The control inputs (OE, CH_SEL, VDD_SEL) are designed to track VDD_CON. An external pull-down resistor tying OE to GND should be used to ensure that bus contention, excessive current, or oscillations do not occur during power-up/power-down. The size of the pull-down resistor is based upon the current-sinking capability of the device driving the OE pin. During normal operation, VDD_HI must be greater than or equal to VDD_LO. During power-up or power-down, VDD_LO may exceed VDD_HI without damaging the device. The recommended power-up sequence is: 1. 2. 3. 4. Apply the power to the first VDD. Apply the power to the second VDD. Set the CH_SEL and VDD_SEL pin according to the application. Drive the OE input high to enable the device.
The recommended the power-down sequence is: 1. 2. 3. 4. Drive the OE input low to disable the device. Remove the setting of CH_SEL and VDD_SEL pin. Remove power from either VDD. Remove power from other VDD.
Table 1. VDDA
OFF ON ON ON ON
Power-Up Operation VDD_HI
Don't Care OFF ON OFF ON
VDD_LO
Don't Care OFF OFF ON ON
VDD_SEL
Don't Care Don't Care HIGH LOW HIGH LOW HIGH LOW
Port B or C Outputs
High Impedance High Impedance Enabled, Reference to VDD_HI High Impedance High Impedance Enabled, Reference to VDD_LO Enabled, Reference to VDD_HI Enabled, Reference to VDD_LO
(c) 2009 Fairchild Semiconductor Corporation FXL3SD206 * Rev. 1.0.0
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FXL3SD206 -- Level Shifting Voltage Translator
DC Electrical Characteristics
TA=-40C to 85C unless otherwise specified.
Symbol
VIHA VIHB VIHC VIH VILA VILB VILC VIL VOHA VOHB VOHC VOLA VOLB VOLC
Parameter
Condition
Data Inputs Dn_A, CMD_A, CLK_A,
VDD_A, VDD_n, (V)
1.65 - 3.6 1.65 - 3.6 1.65 - 3.6
Min.
0.6 x VDD_A 0.6 x VDD_n 0.6 x VDD_n
Max.
Units
V V V V
High Level Input (6) Voltage
Data Inputs Dn_BC, CMD_B, CLK_BC, CH_SEL=H Data Inputs Dn_BC, CMD_C, CLK_BC, CH_SEL=L OE, VDD_SEL, CH_SEL Data Inputs Dn_A, CMD_A, CLK_A, Data Inputs Dn_BC, CMD_B, CLK_BC, CH_SEL=H Data Inputs Dn_BC, CMD_C, CLK_BC, CH_SEL=L OE, VDD_SEL, CH_SEL Data Outputs Dn_A, CMD_A, CLK_A, IHOLD=-20A
1.65 - 3.6 0.6 x VDD_CON 1.65 - 3.6 1.65 -3.6 1.65 -3.6 1.65 - 3.6 1.65 - 3.6 0.75 x VDD_A 1.65 - 3.6 1.65 - 3.6 0.75 x VDD_n 0.75 x VDD_n 0.35 x VDD_A 0.35 x VDD_n 0.35 x VDD_n 0.35 x VDD_CON
V V V V V V V V V V
Low Level Input (6) Voltage
High Level Output (6, 7) Voltage
Data Outputs Dn_BC, CMD_B, CLK_BC, CH_SEL=H, IHOLD=-20A Data Outputs Dn_BC, CMD_B, CLK_BC, CH_SEL=L, IHOLD=-20A Data Outputs Dn_A, CMD_A, CLK_A, IHOLD=+20A
1.65 - 3.6 0.25 x VDD_A 1.65 - 3.6 1.65 - 3.6 0.25 x VDD_n 0.25 x VDD_n
Low Level Output (6, 7) Voltage
Data Outputs Dn_BC, CMD_B, CLK_BC, CH_SEL=H, IHOLD=+20A Data Outputs Dn_BC, CMD_B, CLK_BC, CH_SEL=L, IHOLD=+20A
Notes: 6. Port B and Port C share the same data and clock pin, and VDD_n refers to VDD_HI or VDD_LO, whichever is selected. During normal operation, VDD_HI must be greater than or equal to VDD_LO. 7. This is the output voltage for static conditions. Dynamic drive specifications are given in "Dynamic Output Electrical Characteristics.
(c) 2009 Fairchild Semiconductor Corporation FXL3SD206 * Rev. 1.0.0
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FXL3SD206 -- Level Shifting Voltage Translator
DC Electrical Characteristics (Continued)
TA=-40C to 85C unless otherwise specified.
Symbol
IIODH
Parameter
Condition
VDD_A (V)
3.6 2.7 1.95 3.6
VDD_n (V)
3.6 2.7 1.95 3.6 2.7 1.95 3.6 3.6 0 3.6 0 3.6 1.65 - 3.6 1.65 - 3.6 0 1.65 - 3.6
Min. Max. Units
450 300 200 -450 -300 -200 1.0 2.0 2.0 2.0 2.0 2.0 5.0 2.0 2.0 5.0 A A A A A A A A A A A A A A A A
Bushold Input Data Inputs Dn_A, CMD_A, CLK_A Overdrive High Dn_BC, CMD_B, CMD_C, CLK_BC (8) Current Bushold Input Overdrive Low (9) Current Input Leakage Current Power Off Leakage Current
IIODL
Data Inputs Dn_A, CMD_A, CLK_A Dn_BC, CMD_B, CMD_C, CLK_BC Control Inputs OE, CH_SEL, VDD_SEL, VI=VDD_CON or GND Dn_A, CMD_A, CLK_A; VO=0 to 3.6V Dn_BC, CMD_B, CMD_C, CLK_BC; VO=0 to 3.6V Dn_A, CMD_A, CMD_B, CMD_C, Dn_BC, CLK_A, CLK_BC; VO=0V or 3.6V; OE=VIL Dn_A, CMD_A, CLK_BC; VO=0V or (10) 3.6V; OE=Don't Care Dn_BC, CMD_B, CMD_C, CLK_BC; (10) VO=0V or 3.6V; OE=Don't Care
2.7 1.95 1.65 -3.6 0 3.6 3.6 3.6 0 1.65 - 3.6
II IOFF
IOZ
3-state Output Leakage
ICC
Quiescent Supply (11, 12) Current Quiescent Supply (11) Current
VI=VDDI or GND; IO=0
0 1.65 - 3.6
ICCZ
VI=VDDI or GND; IO=0, OE=VIL
1.65 - 3.6
Notes: 8. An external driver must source at least the specified current to switch LOW-to-HIGH. 9. An external driver must source at least the specified current to switch HIGH-to-LOW. 10. "Don't care" indicates any valid logic level. 11. VDDI is the VDD associated with the input side. 12. Reflects current per supply, VDD_A or VDD_n.
(c) 2009 Fairchild Semiconductor Corporation FXL3SD206 * Rev. 1.0.0
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FXL3SD206 -- Level Shifting Voltage Translator
Dynamic Output Electrical Characteristics
A Port (Dn_A, CMD_A, CLK_A), B and C Port (CMD_B, CMD_C) Output Load: CL=15pF, RL 1M (CI/O=10pF). TA=-40C to 85C.
Symbol
trise tfall IOHD IOLD
Parameter
Output Rise Time A Port Output Fall Time A Port
(13)
VDD=2.8V to 3.6V VDD=2.3V to 2.7V VDD=1.65V to1.95V Typ.
(14) (13)
Units
ns ns mA mA
Max.
3.0 3.0
Typ.
Max.
3.5 3.5
Typ.
Max.
4.0 4.0
Dynamic Output Current High Dynamic Output Current Low
-14.0 +14.0
-10.0 +10.0
-6.2 +6.2
(14)
B and C Port (Dn_BC, CLK_BC) Output Load: CL=30pF, RL 1M (CI/O=10pF). TA=-40C to 85C.
Symbol
trise tfall IOHD IOLD
Parameter
Output Rise Time B and C (13) Port Output Fall Time B and C Port Dynamic Output Current High Dynamic Output Current Low
(14) (13)
VDD=2.8V to 3.6V VDD=2.3V to 2.7V VDD=1.65V to 1.95V Typ. Max.
3.0 3.0 -22.4 +22.4 -15.8 +15.8
Units
ns ns mA mA
Typ.
Max.
3.5 3.5
Typ.
Max.
4.0 4.0
-10.0 +10.0
(14)
Notes: 13. See Figure 9. 14. See Figure 10.
(c) 2009 Fairchild Semiconductor Corporation FXL3SD206 * Rev. 1.0.0
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FXL3SD206 -- Level Shifting Voltage Translator
AC Characteristics
VDD_A=2.8V to 3.6V and TA=-40C to 85C.
Symbol
tPLH, tPHL tPZL, tPZH tPCH tskew
Parameter
A to B/C B/C to A OE to A OE to B/C CH_SEL B to C or C to B A, B, C Port
(15)
VDD_n=2.8V to 3.6V Min.
0.2 0.2
VDD_n=2.3V to 2.7V VDD_n=1.65V to 1.95V Min.
0.3 0.2
Units
ns ns s s ns
Max.
3.5 3.5 1.7 1.7 0.5
Max.
3.9 3.8 1.7 1.7 0.5
Min.
0.5 0.3
Max.
5.4 5.0 1.7 1.7 1.0
VDD_A=2.3V to 2.7V and TA=-40C to 85C.
Symbol
tPLH, tPHL tPZL, tPZH tPCH tskew
Parameter
A to B/C B/C to A OE to A OE to B/C CH_SEL B to C or C to B A, B, C Port
(15)
VDD_n=2.8V to 3.6V Min.
0.2 0.3
VDD_n=2.3V to 2.7V VDD_n=1.65V to 1.95V Min.
0.4 0.4
Units
ns ns s s ns
Max.
3.8 3.9 1.7 1.7 0.5
Max.
4.5 4.5 1.7 1.7 0.5
Min.
0.5 0.5
Max.
5.6 5.5 1.7 1.7 1.0
VDD_A=1.65V to 1.95V and TA=-40C to 85C.
Symbol
tPLH, tPHL tPZL, tPZH tPCH tskew
Parameter
A to B/C B/C to A OE to A OE to B/C CH_SEL B to C or C to B A, B, C Port
(15)
VDD_n=2.8V to 3.6V Min.
0.3 0.5
VDD_n=2.3V to 2.7V VDD_n=1.65V to 1.95V Min.
0.5 0.5
Units
ns ns s s ns
Max.
5.0 5.4 1.7 1.7 1.0
Max.
5.5 5.6 1.7 1.7 1.0
Min.
0.8 0.8
Max.
6.7 6.7 1.7 1.7 1.0
Note: 15. Skew is the variation of propagation delay between output signals and applies only to output signals on the same port and switching with the same polarity (LOW to HIGH or HIGH to LOW). See Figure 12. Skew is guaranteed, but not tested.
(c) 2009 Fairchild Semiconductor Corporation FXL3SD206 * Rev. 1.0.0
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FXL3SD206 -- Level Shifting Voltage Translator
Maximum Data Rate(16)
TA=-40C to 85C.
VDD_A
VDD_A=2.8 to 3.6V VDD_A=2.3 to 2.7V VDD_A=1.65 to 1.95V
Direction
A to B/C B/C to A A to B/C B/C to A A to B/C B/C to A
VDD_n=2.8V to 3.6V Min.
100 100 100 100 80 80
VDD_n=2.3V to 2.7V VDD_n=1.65V to 1.95V Min.
100 100 100 100 80 80
Units
Mbps Mbps Mbps
Min.
80 80 80 80 60 60
Note: 16. Maximum Data Rate is specified in megabits per second. See Figure 11. It is equivalent to two times the fTOGGLE frequency, specified in megahertz. For example, 100Mbps is equivalent to 50MHZ.
Capacitance
TA=+25C.
Symbol
CIN CI/O CPD
Parameter
Input Capacitance Control Pins (OE, VDD_SEL, CH_SEL) Input/Output Capacitance Dn_A, CMD_A,CLK_A Dn_BC, CMD_B, CMD_C, CLK_BC
Conditions
VDD_CON=GND VDD_A=VDD_n=3.3V, OE=VDD_A, CH_SEL=VDD_A or GND VDD_A=VDD_n=3.3V, VI=0V or VDD, f=10MHZ
Typical
4.0 5.0 6.5 25
Units
pF pF pF
Power Dissipation Capacitance
(c) 2009 Fairchild Semiconductor Corporation FXL3SD206 * Rev. 1.0.0
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FXL3SD206 -- Level Shifting Voltage Translator
Test Diagrams
VCC TEST SIGNAL
DUT
C1
R1
Figure 5. AC Test Circuit
Table 2.
AC Test Conditions Test
tPLH, tPHL tPZL tPZH
Input Signal
Data Pulses 0V VCCI
Output Enable Control
VI=VDD_CON LOW to HIGH Switch LOW to HIGH Switch
Table 3.
AC Load VCCo CL
Port A, CMD_B, CMD_C 15pF 15pF 15pF Dn_BC, CLK_BC 30pF 30pF 30pF
RL
Port A, B, or C 1M 1M 1M
Port A, B, or C 1.8V 0.15V 2.5V 0.2V 2.8V to 3.6V
DATA IN tpxx DATA OUT
Vmi tpxx Vmo
VCCI GND
VCCO
Figure 6. Waveform for Inverting and Non-Inverting Functions Notes: 17. Input tR = tF = 2.0ns, 10% to 90%. 18. Input tR = tF = 2.5ns, 10% to 90%, at VI = 3.0V to 3.6V only.
(c) 2009 Fairchild Semiconductor Corporation FXL3SD206 * Rev. 1.0.0
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FXL3SD206 -- Level Shifting Voltage Translator
OUTPUT CONTROL tPZL DATA OUT
Vmi
VCC_CON GND
VY
VOL
Figure 7. 3-State Output Low Enable Time for Low Voltage Logic Notes: 19. Input tR = tF = 2.0ns, 10% to 90%. 20. Input tR = tF = 2.5ns, 10% to 90%, at VI = 3.0V to 3.6V only.
OUTPUT CONTROL tPZH DATA OUT
Vmi
VCC_CON GND VOH
Vx
Figure 8. 3-State Output High Enable Time for Low Voltage Logic
Notes: 21. Input tR = tF = 2.0ns, 10% to 90%. 22. Input tR = tF = 2.5ns, 10% to 90%, at VI = 3.0V to 3.6V only.
Symbol
VMI VMO VX VY
VDD
VDDI /2 VDDo /2 0.9 x VDDo 0.1 x VDDo
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FXL3SD206 -- Level Shifting Voltage Translator
trise
VOH 80% x VCCO
VOUT 20% x VCCO Time
IOHD (CL + CI / O ) x VOUT (20% - 80%) * VCCO = (CL + CI / O ) x t t RISE
VOL
Figure 9. Active Output Rise Time and Dynamic Output Current High
VOH 80% x VCCO VOUT
tfall
20% x VCCO Time
IOHD (CL + CI / O ) x Figure 10.
VOL
VOUT (80% - 20%) * VCCO = (CL + CI / O ) x t t FALL
Active Output Fall Time and Dynamic Output Current Low
tW DATA IN VCCI/2 VCCI/2 VCCI GND Maximum Data Rate, f = 1/tW
Figure 11. Maximum Data Rate
DATA OUTPUT tskew DATA OUTPUT
VCCO Vmo Vmo tskew VCCO Vmo Vmo GND GND
tskew = (tpHLmax - tpHLmin) or (tpLHmax - tpLHmin)
Figure 12.
(c) 2009 Fairchild Semiconductor Corporation FXL3SD206 * Rev. 1.0.0
Output Skew Time
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FXL3SD206 -- Level Shifting Voltage Translator
Physical Dimensions
2.80 2.23 0.10 C 0.66 2.50 0.56
2X
A
B
1
24
19
0.40
PIN #1 IDENT
2.23 3.40
13
3.70
0.10 C
7
TOP VIEW
2X
0.23
RECOMMENDED LAND PATTERN
0.55 MAX. 0.10 C 0.08 C 0.05 0.00
0.15
SEATING PLANE
C
SIDE VIEW
7
23X
0.35 0.45
13
0.40
1
0.45 0.55
24
19
0.15 24X 0.25 0.10 C A B 0.05 C
BOTTOM VIEW
Figure 13.
24-Pin, Micro-MLP, Quad, .6mm Thick, 2.5mm x 3.4mm Body
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild's worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor's online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/.
(c) 2009 Fairchild Semiconductor Corporation FXL3SD206 * Rev. 1.0.0 www.fairchildsemi.com 15
FXL3SD206 -- Level Shifting Voltage Translator
(c) 2009 Fairchild Semiconductor Corporation FXL3SD206 * Rev. 1.0.0
www.fairchildsemi.com 16


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